Samsung's $200 Billion Giant Chip Deal With Broadcom

Samsung's semiconductor arm signed a $200 billion giant chip production agreement with US-based Broadcom, valid until 2030. Samsung's semiconductor arm signed one of the biggest deals of recent years. The company announced a $200 billion strategic cooperation with US-based Broadcom, which will be valid until 2030. 2 nm manufacturing, HBM memory and advanced packaging Under the agreement, Samsung will supply advanced memory chips to Broadcom and produce the special chips (ASIC) designed by the company with 2 nm manufacturing technology. The parties will also work together on next-generation high-bandwidth memory (HBM) solutions and advanced chip packaging technologies.

Cooperation is not limited to memory supply and production. The agreement also covers Samsung's 2.3D and 2.5D advanced packaging technologies. These technologies are critical, especially in artificial intelligence accelerators, as they provide higher performance and lower power consumption.

The agreement will also cover sub-2nm production technologies that Samsung will commercialize in the future. The memory solutions erators. While the increasing demand for artificial intelligence makes HBM memories and advanced packaging technologies one of the most critical areas of the industry, the two companies will continue their cooperation in this field until 2030. An important step against TSMC Although Samsung Foundry continues to lag behind market leader TSMC in contract chip production, the company has accelerated its investments in 2 nm production technologies and HBM memory in recent years.