The Company Targets Mass Production of Emib-t in 2027, According to Taiwan-based Substrate Maker Unimicron

The company targets mass production of EMIB-T in 2027, according to Taiwan-based substrate maker Unimicron. Intel's EMIB family includes EMIB, EMIB-M, and EMIB-T variants, with EMIB-T leveraging TSV technology for direct power access in ASIC chips. Unimicron reports that ASIC developers like Broadcom and Meta are considering switching from CoWoS to Intel's EMIB to cut costs, with savings reaching 50% depending on design complexity, especially for those requiring expensive silicon interposers.

TSMC currently controls over 80-85% of the advanced packaging market for AI accelerators from Nvidia, AMD, Apple, and Amazon. However, TSMC faces technical challenges with CoWoS-L packaging for Nvidia's Vera Rubin architecture, including warping issues in four-die packages. Intel aims to attract customers by enabling multi-reticle large dies with HBM memory in a single package, potentially winning business from TSMC in advanced packaging.